Packaging

PACKAGING ARTICLES


Dow Corning teams with SUSS on TSV bonding process

06/25/2012 

Dow Corning will collaborate with SUSS MicroTec on a temporary bonding process (materials and equipment) for through-silicon vias (TSV) in high-volume advanced semiconductor packaging.
New speaker added for 3D and 2.5D Integration webcast

06/25/2012 

Solid State Technology will present 3D and 2.5D Integration: A Status Report on June 27, free for all attendees. William Chen, ASE, will join speakers David McCann, GLOBALFOUNDRIES and E. Jan Vardaman, TechSearch International.
SEMICON West 2012 exhibits preview: Semiconductor packaging products

06/22/2012 

SEMICON West is taking place July 10-12 in San Francisco, CA. Following are new products for semiconductor packaging and test that will be at the show, from wafer bonders to LED die attach materials.
Rudolph buys NanoPhotonics to bolster advanced packaging inspection offering

06/21/2012 

Rudolph Technologies Inc. (NASDAQ:RTEC) acquired the assets of NanoPhotonics GmbH, adding inspection technology and an intellectual property (IP) portfolio to serve its advanced package inspection tool customers.
High-volume MEMS manufacturer adds FOGALE metrology tool

06/20/2012 

A major high-volume MEMS maker has purchased a FOGALE nanotech T-MAP DUAL 3D 200A for its US manufacturing facility. The tool will be equipped with 2 load ports and will be fully automated.
June 27th webcast on 3D integration

06/20/2012 

In a webcast scheduled for June 27th at 1:00 Eastern, 11:00 Pacific, David McCann of GLOBALFOUNDRIES will provide a status report on advanced packaging and 3D integration. McCann is responsible for Packaging R&D and back-end strategy and implementation at GLOBALFOUNDRIES.
AMAT’s Varian integration continues with Dickerson named president

06/20/2012 

In mid-2011, semiconductor manufacturing and assembly equipment supplier Applied Materials (NASDAQ:AMAT) acquired Varian Semiconductor Equipment Associates Inc. Now, the company is adding Varian’s former CEO Gary Dickerson as president.
Fast-curing conductive chip-attach adhesive meets RFID packaging needs

06/20/2012 

DELO introduced the DELOMONOPOX AD268 epoxy resin to meet the low-cost, reliable-attach needs of RFID device makers. The anisotropic, electrically conductive adhesive provides fast cure at chip attach, and is designed for flip-chip RFID packaging, as well as other packaging applications.
Wafer-level RF testing bottleneck resolved with Advantest, Hua Hong NEC methodology

06/20/2012 

Pure-play foundry Shanghai Hua Hong NEC and test equipment supplier Advantest co-developed a wafer-level, multi-site parallel test scheme for RFID semiconductor devices that meets industry-standard ISO 14443 guidelines.
Signetics bolsters mobile chip packaging capacity with large tool buy

06/19/2012 

Signetics Corporation approved plans to purchase additional semiconductor assembly process equipment -- wafer grinders, wafer saws, die attach tools, and wire bonders -- to grow its packaging capacity for mobile chips.
STATS ChipPAC ships 1 billionth package using copper wire bonds

06/18/2012 

STATS ChipPAC Ltd. (SGX-ST: STATSChP) marked the milestone of 1 billion copper wirebonded semiconductor units shipped.
Silicon chip-on-board LED substrate enables best thermal dissipation

06/18/2012 

Daewon Innost achieved what it says is the LED industry’s best thermal dissipation performance on its Glaxum LED Array family, based on the proprietary Nano-Pore Silicon Substrate (NPSS) technology.
DARPA seeks microfluidic thermal management for 3D ICs

06/18/2012 

DARPA
ECTC

06/15/2012 

Attendance was high at this year's Electronic Component Technology Conference (ECTC) in San Diego. Sandra Winkler is senior industry analyst at New Venture Research and IEEE/CPMT Luncheon Program Chair, shares the key trends in ECTC's sessions, like WLP, 2.5D, LED packaging, and more.
Anritsu plans on-wafer high-frequency test demo at IMS

06/15/2012 

Anritsu will demonstrate its broadband Vector Network Analyzer (VNA), which conducts single sweeps from 70kHz to 140GHz during wafer probe test, at IMS, showcasing a new 0.8mm connector.
Luminus Devices cuts LEDs’ thermal resistance 30% with new packaging

06/14/2012 

Luminus Devices Inc. is reducing thermal resistance in its Big Chip LED devices by 30% with new packaging technology.
Metrology merger: MicroSense acquires SigmaTech

06/13/2012 

MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.
StratEdge improves thermal management in power semiconductors with LL packages

06/13/2012 

The LL leaded laminate copper-moly-copper base packages dissipates heat from high-power compound semiconductor devices, such as gallium nitride, gallium arsenide, and silicon carbide chips.
USI process produces copper-filled vias on ceramic substrates

06/12/2012 

UltraSource Inc. announced CopperVia, a process that fills vias with pure copper to yield low-cost, high-conductivity, reliable electrical and thermal interconnects in ceramic thin film circuit substrates.
ESCATEC offers package-on-package stacking for low-volume designs

06/12/2012 

ESCATEC added package-on-package (PoP) capability at its Heerbrugg, Switzerland, facility, adding a dipping unit for ball grid array (BGA) packages on its Siplace assembly line.



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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