03/01/2001  Until recently, controlled collapse chip connection bump technology, developed in the late 1960s, provided a reliable interconnect for high-performance, leading-edge microprocessors

03/01/2001  Situated in the shadows of Scotland's Edinburgh Castle is The Roslin Institute, the birthplace of the famous cloned sheep, Dolly, and the site where human monoclonal antibodies for melanoma and other cancers are produced inside the eggs of genetically modified chickens.

03/01/2001  England...France...Germany...

03/01/2001  PITTSBURGH—Seagate Technology Inc.'s decision to build a research facility here is providing opportunity to two distinct classes of workers.

02/28/2001  February 28, 2001--San Jose, California--Nanya Technology Corp. announced that it has received validation for its double data rate synchronous dynamic random access memory (DDR SDRAM) modules from Advanced Micro Devices (AMD) and VIA Technologies. This new technology allows AMD and VIA to better utilize the maximum speeds of its processors, chipsets, and system bus speeds.

02/28/2001  February 28, 2001--Santa Clara, California--To help photolithography engineers and IC designers predict the manufacturability of their products before going into production, ASML MaskTools has developed LithoCruiser--a simulation toolset for designing and optimizing lithography processes.

02/28/2001  February 28, 2001--Chandler, Arizona--In response to current business conditions, Microchip Technology is reducing wafer capacity at its two Arizona wafer fabs, delaying the start date for its Puyallup, WA, wafer fab until December 2002, and idling its Hong Kong test facility during the June 2001 quarter by diverting test requirements to its Thailand facility. Additionally, the company will lay off approximately 400 employees worldwide.

02/27/2001  February 27, 2001--Seoul, Korea--Samsung Electronics, a leading supplier of memory devices, and Intel Corp. have entered a strategic relationship aimed at expanding the market for Rambus DRAM (RDRAM), a next generation, high-speed memory product.

02/27/2001  Feb. 27, 2001 -- BOSTON, MA -- In recent years, the issue of controlling airborne molecular contaminants (AMC) has become more important as wafer geometries expand and line width intervals tighten. The number of ways to apply chemical filtration for the control of AMC have grown, just as the methods employed to measure AMC and evaluate filter system performance have increased..

02/27/2001  February 27, 2001--Milan, Italy--The Prime Minister of Italy, Mr Giuliano Amato, today formally inaugurated STMicroelectronics' R2 Technology Center, the latest addition to its global network of advanced microelectronics R&D centers and wafer fabrication plants.

02/27/2001  Feb. 27, 2001 -- PORTLAND, OR -- Hoping to enhance Oregon's pool of potential high-tech workers, SEMI is planning its first Pacific Northwest educational campaign in which 25 area high school students will embark on a program that will teach them the basics of semiconductors and cleanrooms protocol, among others.

02/27/2001  February 27, 2001--Langen, Germany--Nikon Corp., a leader in semiconductor optical manufacturing equipment, and Tower Semiconductor Ltd., an Israel-based specialized wafer foundry, announced today that Tower has selected Nikon's DUV scanner systems and i-line steppers for its new fab, known as Fab 2.

02/26/2001  February 26, 2001--Portland, Oregon--SEMI, the global industry association for semiconductor equipment and materials companies, will launch a Pacific Northwest educational campaign on Wednesday, March 7, to interest high school students in technology careers.

02/26/2001  February 26, 2001--Fort Lauderdale, Florida--Lambda Physik Inc.'s new Gator Series DPSS lasers cut and drill microfeatures in silicon at production speeds with no redeposition of material or microcracking. Its near-diffraction-limited beam quality produces small focus spot sizes to create narrow kerf widths for wafer segmentation applications, and high quality microvias under 20-microns in diameter.

02/26/2001  February 26, 2001--Jupiter, Florida--Photronics, Inc. announced today that its Sub-Wavelength Reticle Solutions phase shift photomasks were recently used as part of a joint development effort that successfully demonstrated the ability to produce sub-100nm features using KrF (248nm) exposure technology.

02/26/2001  February 26, 2001--Glouchester, Massachusetts--Varian Semiconductor Equipment Associates, Inc., a supplier of ion implantation systems, today announced that it has received an order for a VIISta 810 ion implanter from UMC, a world-leading foundry services provider headquartered in Hsinchu, Taiwan.

02/26/2001  February 26, 2001--East Fishkill, New York--IBM Corp. today announced an interactive Internet-based microchip design environment to help customers speed development of high-performance custom chips.

02/23/2001  KALISPELL, MT - New new aqueous-based technology produces simplified removal of post-poly silicon etch residue with a significant reduction in the use of chemicals and water.

02/23/2001  February 23, 2001--Leuven, Belgium--Growing market pressure for high-performance semiconductors is compelling the industry to introduce new technologies at an unprecedented rate and, as a result, has prompted IMEC, an independent research center located in Leuven, Belgium, and Sony Corp., based in Tokyo, Japan, to collaborate on wireless LAN and bipolar CMOS process technologies.

02/23/2001  Feb. 23, 2001 -- SARAWAK, Malaysia -- Sarawak has received its first 200 mm wafer fab following the opening of a $1.7 billion facility at the Sama Jaya Free Zone.