SST Subscribe

Paid Subscription Information

One year (8 issues) paid subscriptions to Solid State Technology are available at the following rate:

One Year (U.S.)	$258
One Year (Canada)	$360
One Year (International)	$434
Two Years (U.S.)	$413
Two Years (Canada)	$573
Two Years (International)	$691
One Year (Digital)	$130

You will select your subscription option during checkout.

Subscription Mailing Address

* denotes required field.

First Name *
Last Name *
Job Title *
Company Name *
Street Address *
Department / Mail Stop
City *
State / Province *
Country *
ZIP / Postal Code *
Email Address *
Confirm Email *

Account and Billing address are the same.

Billing Address (as appears on card statement)

Your Name *
Street Address *
Department / Mail Stop
City *
State / Province *
ZIP / Postal Code *
Country *

What is your Job Function: (Check only one) *	Engineering Managment Manufacturing & Operations Management Design & Development Engineering Management Production/Process Manufacturing Engineering Packaging/Assembly Engineering Reliability, QA/QC, Evaluation, Testing Plant/Facilities/Maintenance Engineering/Operation Engineering Staff Corporate Management Purchasing Other

What is your industry/market focus? (Check ALL that apply) *	Semiconductor Manufacturing Semiconductor Manufacturing Equipment Semiconductor Materials Supplier Packaging Equipment Manufacturer Semiconductor In-house Packaging MEMS Manufacturing LEDs Manufacturing Displays Manufacturing Compound Semiconductor Manufacturing Power Electronics Test and Measurement Equipment Outsourced Semiconductor Assembly and Test Service Independent Research and Development Laboratory Other

As a part of responsibilities, I: (Check ALL that apply) *	Manage Department Of Larger Organization Manage or Supervise a Project Team Manage or Supervise one or more Projects Have other Management or Supervisory Responsibility Other

I authorize, influence, specify or buy the following products: (Check ALL that apply) *

A. Semiconductor Manufacturing Automation/Wafer Handling Chemicals & Materials Deposition Etching/Planarization Gases/Gas Handling Lithography Packaging/Assembly Process Control Test/Metrology Inspection Thermal Processing/Implant Vacuum Equipment Wafer Cleaning	D. Display Manufacturing Automation/Wafer Handling Chemicals & Materials Contamination Control Deposition Etching/Planarization Gases/Gas Handling Lithography Packaging/Assembly Test/Metrology Inspection Thermal Processing/Implant Vacuum Equipment

B. Advanced Packaging D Integration process equipment Bonding, Wire, Die, TAB Dicing, Scribing and die separation Flipchip/BGA process equipment Materials Packaging, encapsulating, sealing Test Equipment TSV process equipment	E. LEDs Manufacturing Automation/Wafer Handling Chemicals & Materials Contamination Control Deposition/MOCVD Etching/Planarization Gases/Gas Handling Lithography Packaging/Assembly Test/Metrology Inspection Thermal Processing/Implant Vacuum Equipment Other

C. MEMS Manufacturing Automation/Wafer Handling Chemicals & Materials Contamination Control Deposition Etching/Planarization Gases/Gas Handling Lithography Packaging/Assembly Test/Metrology Inspection Thermal Processing/Implant Vacuum Equipment None of the Above