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Worldwide silicon wafer area shipments increased during the third quarter 2018, surpassing record second quarter 2018 area shipments to set another all-time high, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Total silicon wafer area shipments reached 3,255 million square inches during the most recent quarter, a 3.0 percent rise from the 3,164 million square inches shipped during the previous quarter. New quarterly total area shipments clocked in 8.6 percent higher than third quarter 2017 shipments.

“Silicon shipment volumes remained at record levels during the third quarter,” said Neil Weaver, chairman SEMI SMG and Director, Product Development and Applications Engineering of Shin Etsu Handotai America. “Silicon shipments are mirroring this year’s strong semiconductor unit growth in support of a growing and diversified electronics market during our stable economy.”

Silicon Area Shipment Trends – Semiconductor Applications Only
Millions of Square Inches
1Q2017
2Q2017
3Q2017
4Q2017
1Q2018
2Q2018
3Q2018
Total
2,858
2,978
2,997
2,977
3,084
3,164
3,255

Source: SEMI, (www.semi.org), November 2018

Silicon wafers are the fundamental building material for semiconductors, which in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin round disks are produced in various diameters (from one inch to 12 inches) and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.

All data cited in this release is inclusive of polished silicon wafers, including virgin test wafers and epitaxial silicon wafers, as well as non-polished silicon wafers shipped by the wafer manufacturers to the end-users.

The Silicon Manufacturing Group (SMG)  is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi, etc.). The purpose of the group is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

GLOBALFOUNDRIES today announced the establishment of Avera Semiconductor LLC, a wholly owned subsidiary dedicated to providing custom silicon solutions for a broad range of applications. Avera Semi will leverage deep ties with GF to deliver ASIC offerings on 14/12nm and more mature technologies while providing clients new capabilities and access to alternate foundry processes at 7nm and beyond.

Avera Semi is built upon an unrivaled legacy of ASIC expertise, tapping into a world-class team that has executed more than 2,000 complex designs in its 25-year history. With more than 850 employees, annual revenues in excess of $500 million, and over $3 billion in 14nm designs in execution, Avera Semi is well positioned to serve clients developing products across a wide range of markets, including wired and wireless networking, data centers and storage, artificial intelligence and machine learning, and aerospace and defense.

The new company is led by Kevin O’Buckley, a leader in the ASIC business since joining GF as part of the acquisition of IBM Microelectronics in 2015. Previously, he spent nearly 20 years at IBM in a variety of roles spanning both technical and executive leadership positions.

“I couldn’t imagine a better time to launch a new venture focused on delivering custom ASIC solutions,” O’Buckley said. “Data traffic and bandwidth demands have exploded, and next-generation systems for cloud and communications must deliver more performance and handle more complexity than ever before. Avera Semi has the right combination of expertise and technology to help our clients design and build high-performance, highly optimized semiconductor solutions.”

“Arm has a long history of collaborating with the team building Avera Semi to enhance PPA and bring innovative solutions to market,” said Drew Henry, senior vice president and general manager, Infrastructure Line of Business, Arm. “As the needs for compute requirements continue to evolve and diversify, we look forward to joining Avera’s capabilities and technologies with Arm Neoverse solutions and physical design IP to deliver unique value to a broad customer base.”

“Synopsys’ long history of collaboration with GF has enabled us to deliver a broad portfolio of high-quality DesignWare IP on a range of GF processes,” said John Koeter, vice president of marketing for IP at Synopsys. “We look forward to continuing this success with Avera Semi to provide designers with the necessary IP for their next-generation, high-performance SoC designs on advanced FinFET processes.”

Avera Semi offers clients a range of capabilities to enable end-to-end silicon solutions:

●      ASIC offerings on both leading-edge and proven process technologies, including a newly established foundry partnership on 7nm
●      A rich IP portfolio, including high-speed SerDes, high-performance embedded TCAMs, ARM® cores and performance and density-optimized embedded SRAMs
●      A comprehensive, production-proven design methodology that builds on a strong record of first-time-right results to help reduce development costs and time-to-market
●      Advanced packaging options to increase bandwidth, eliminate I/O bottlenecks, and reduce memory area, latency and power
●      Flexible ASIC business engagement models that give clients the ability to supplement in-house resources with the level of support needed from experienced chip design, methodology, test and packaging teams

“2017 was an unprecedented year for semiconductor industry,” commented Santosh Kumar, Director of Packaging, Assembly and Substrates at Yole Korea, part of Yole Développement (Yole). “The market grow by 21.6% year-to-year to reach record of almost US$412 billion.”

Under this dynamic context, the advanced packaging industry is playing a key role, offering huge opportunities of innovation for the companies involved. According to Yole’s analyst, Santosh Kumar, the advanced packaging market should reach about US$ 39 billion in 2023.

The market research and strategy consulting company Yole, releases this month, its famous report, Status of the Advanced Packaging Industry. Santosh Kumar, with the help of the advanced packaging team at Yole, proposes today an impressive 2018 edition with key market trends, the description of technology evolution, a detailed analysis of the competitive landscape.

For the 1st time, this technology & market report includes a specific section dedicated to the advanced packaging technologies in the new semiconductor era. It offers a short term and long term outlook, with detailed roadmaps. It also details the impact of front-end scaling on advanced packaging. In addition Yole’s team points out the competitive landscape, with disruption and opportunities, detailed supply chain, production splits by manufacturers.

“This report is part of our key advanced packaging technology & market analyses,” asserts Emilie Jolivet, Director, Semiconductor & Software at Yole. “Thanks to this report, we built a strong reputation and became step by step one of the major consulting companies in this area.”

To highlight results of this new advanced packaging report, Yole combines the release of this report with the relevant interview of a key advanced packaging player, Amkor Technology. OSATs clearly play a significant role in the evolution of the industry and Ron Huemoeller, Corporate Vice President, Head of WWRD & Technology Strategy and Christopher A. Chaney, IRC, Vice President, Investor Relations, both at Amkor Technology agreed to share their vision with @Micronews readers: More.

Between 2017 and 2023, the total packaging market’s revenue will grow at 5.2% CAGR . In parallel, over the same period, the advanced packaging market will grow at 7% CAGR. On the other hand, the traditional packaging market will grow at a lower CAGR of 3.3%.

Of the different advanced packaging platforms, 3D TSV and fan-out will grow at rates of 29% and 15%, respectively. Flip-chip, which constitutes the majority of the advanced packaging market, will grow at CAGR of almost 7%. Meanwhile, fan-in WLP will grow at a 7% CAGR from 2017 – 2023, mainly led by mobile.

“Advanced packages will continue their important role of addressing high-end logic and memory in computing and telecom, with further penetration in analog and RF in high-end consumer/mobile segments,” analyses Santosh Kumar from Yole. All of this while eyeing opportunities in the growing automotive and industrial segments.

What’s happened in 2017? According to Yole, two advanced packaging roadmaps are foreseen:
•  Scaling: going to sub10 nm nodes
•  And functional: staying above 20nm nodes.

In parallel, the semiconductor industry is developing products on both of them. Under this favorable context, advanced semiconductor packaging is seen as a way to increase the value of a semiconductor product, adding functionality, maintaining/increasing performance while lowering cost.
Both roadmaps hold more multi-die heterogeneous integration including SiP and higher levels of package customization in the future. A variety of multi-die packaging is developing in both high and low end, for consumer, performance and specialized applications. Heterogeneous integration has created opportunities for both the substrate and WLP based SiP.

2017 also show the merger of 3 competitive areas that will continue to develop: PCB vs. substrate, substrate vs. Fan-Out and Fan-Out vs. 2.5D/3D.

It will be difficult to repeat 2017 performances and Yole’s Semiconductor & Software team went further in its investigation this year again, to propose you today a comprehensive analysis of this evolution. Lot of questions are still pending and the Status of the Advanced Packaging industry will give you a deep understanding of the megatrends impacting this industry, the related business opportunities and technical innovations. A detailed description of this report is available on i-micronews.com, advanced packaging reports section.

Cynthia Wright, a retired military officer with over 25 years of experience in national security and cyber strategy and policy, now Principal Cyber Security Engineer at The MITRE Corporation, will give the opening keynote at the upcoming MEMS & Sensors Executive Congress, October 29-30, 2018 in Napa, Calif. SEMI’s Maria Vetrano interviewed Wright to give MSEC attendees an advance look at Wright’s highly anticipated presentation.

SEMI: MEMS and sensors suppliers provide intelligent sensing and actuation to hundreds of billions of autonomous mobility devices – but historically, our community has not been at the forefront of cybersecurity. Why is now a good time for us to get involved?

Wright: From wearables, smartphones, refrigerators and agriculture to medical devices and military hardware, autonomous mobility devices pervade our lives. At the same time, Internet of Things (IoT) botnet attacks like Mirai — and other demonstrated cyberattacks on home devices, vehicles and infrastructure — highlight the increasingly urgent need to address cybersecurity and privacy in MEMS/sensors-enabled devices.

As building-block players in autonomous devices, MEMS and sensors suppliers have several good reasons to get involved.

The number of IoT cyber security bills before state and federal legislatures suggest that regulation is coming, and it is in everyone’s best interest to prepare. While original equipment manufacturers (OEMs) would generally be held liable in cases of component malfunction or data breach, if insecurity stems from a microelectromechanical component, OEMs would most likely choose component suppliers with secure products.

Beyond legislation and competitive advantage, we must consider that people’s well-being, even lives, could be at stake. Imagine what could happen if someone hacks into an insulin pump, the accelerometer on a train, or the LIDAR of an autonomous car. Intrusions of this sort could prove catastrophic.

SEMI: Where do you perceive the biggest potential threats to consumers, industry, government?

Wright: In good military fashion, I would say that it depends. If a person is a consumer of medical implants, that’s a big threat. On the government side, we could be talking about networked devices involved in military situational awareness. In industry, it could be sensors governing critical manufacturing or safety processes.

I am not saying that every sensor must be secure. In every sector, there are areas of greater or lesser vulnerability, depending on context.

SEMI: What is security or privacy by design?

Wright: Addressing security flaws is cheaper and more easily accomplished at the design stage and not after the vulnerabilities are discovered. At MITRE, we practice systems- and design-oriented thinking as we consult with people doing development. We help them to develop security standards and approaches that are broadly applicable, rather than focusing on a specific product.

For example, MITRE looks at the ways that a person might hack into a car to steal location and life history data — or alter its functions — to facilitate general standards and approaches that will help manufacturers better ensure the privacy and security of autonomous vehicles. Hackers have demonstrated that they can interfere with vehicle transmissions and brakes. Ignition, steering and other critical systems are theoretically accessible through the same types of attacks. To what degree can MEMS/sensors suppliers help automotive manufacturers ensure the privacy and security of autonomous cars, and the safety of their drivers?

SEMI: What would you like MSEC attendees to take away from your presentation?

Wright: MEMS/sensors suppliers are on the leading edge of computing and should take some responsibility for considering cybersecurity and privacy, for the safety of their customers and their own competitive advantage. Recognize which devices should be secure and act accordingly. Get involved at the design stage. The market for secure microelectronics is only going to grow, and this will benefit suppliers who take secure design seriously.

Cynthia Wright will present Cyber Security and Privacy in the Age of Autonomous Sensing on Monday, October 29 at MEMS & Sensors Executive Congress in Napa, Calif.

Register today to connect with her at the event.

Maria Vetrano is a public relations consultant at SEMI.

The average revenue generated from processed wafers among the four biggest pure-play foundries (TSMC, GlobalFoundries, UMC, and SMIC) is expected to be $1,138 in 2018, when expressed in 200mm-equivalent wafers, which is essentially flat from $1,136 in 2017, according to a new analysis by IC Insights (Figure 1).  The average revenue per wafer among the Big 4 foundries peaked in 2014 at $1,149 and then slowly declined through last year, based on IC Insights’ extensive part-two analysis of the integrated circuit foundry business in the September Update to The 2018 McClean Report.

Figure 1

TSMC’s average revenue per wafer in 2018 is forecast to be $1,382, which is 36% higher than GlobalFoundries’ $1,014.  UMC’s average revenue per wafer in 2018 is expected to be only $715, about half of the projected amount at TSMC this year.  Furthermore, TSMC is the only foundry among the Big 4 that is expected to generate higher revenue per wafer (9% more) in 2018 than in 2013.  In contrast, GlobalFoundries, UMC, and SMIC’s 2018 revenue per wafer averages are forecast to decline by 1%, 10%, and 16%, respectively, compared to 2013.

Although the average revenue per wafer of the Big 4 foundries is forecast to be $1,138 this year, the amount generated is highly dependent upon the minimum feature size of the IC processing technology. Figure 2 shows the typical 2Q18 revenue per wafer for some of the major technology nodes and wafer sizes produced by pure-play foundries.  In 2Q18, there was more than a 16x difference between the 0.5µ 200mm revenue per wafer ($370) and the ≤20nm 300mm revenue per wafer ($6,050).  Even when using revenue per square inch, the difference is dramatic ($7.41 for the 0.5µ technology versus $53.86 for the ≤20nm technology).  Since TSMC gets such a large percentage of its sales from ≤45nm production, its revenue per wafer is expected to increase by a compound annual growth rate (CAGR) of 2% from 2013 through 2018 as compared to a -2% CAGR for the total revenue per wafer average of GlobalFoundries, UMC, and SMIC during this same timeperiod.

Figure 2

There will probably be only three foundries able to offer high-volume leading-edge production over the next five years (i.e., TSMC, Samsung, and Intel).  IC Insights believes these companies are likely to be fierce competitors among themselves—especially TSMC and Samsung—and as a result, pricing will likely be under pressure through 2022.

Technion, Israel’s technological institute, announced this week that Intel is collaborating with the institute on its new artificial intelligence (AI) research center. The announcement was made at the center’s inauguration attended by Dr. Michael Mayberry, Intel’s chief technology officer, and Dr. Naveen Rao, Intel corporate vice president and general manager of the Artificial Intelligence Products Group.

“AI is not a one-size-fits-all approach, and Intel has been working closely with a range of industry leaders to deploy AI capabilities and create new experiences. Our collaboration with Technion not only reinforces Intel Israel’s AI operations, but we are also seeing advancements to the field of AI from the joint research that is under way and in the pipeline,” said Naveen Rao, Intel corporate vice president and general manager of Artificial Intelligence Products Group

The center features Technion’s computer science, electrical engineering, industrial engineering and management departments, among others, all collaborating to drive a closer relationship between academia and industry in the race to AI. Intel, which invested undisclosed funds in the center, will represent the industry in leading AI-dedicated computing research.

Intel is committed to accelerating the promise of AI across many industries and driving the next wave of computing. Research exploring novel architectural and algorithmic approaches is a critical component of Intel’s overall AI program. The company is working with customers across verticals – including healthcare, autonomous driving, sports/entertainment, government, enterprise, retail and more – to implement AI solutions and demonstrate real value. Along with Technion, Intel is also involved in AI research with other universities and organizations worldwide.

Intel and Technion have enjoyed a strong relationship through the years, as generations of Technion graduates have joined Intel’s development center in Haifa, Israel, as engineers. Intel has also previously collaborated with Technion on AI as part of the Intel Collaborative Research Institute for Computational Intelligence program.

In its September Update to The 2018 McClean Report, IC Insights discloses that over the past two years, DRAM manufacturers have been operating their memory fabs at nearly full capacity, which has resulted in steadily increasing DRAM prices and sizable profits for suppliers along the way.  Figure 1 shows that the DRAM average selling price (ASP) reached $6.79 in August 2018, a 165% increase from two years earlier in August of 2016. Although the DRAM ASP growth rate has slowed this year compared to last, it has remained on a solid upward trajectory through the first eight months of 2018.

Figure 1

The DRAM market is known for being very cyclical and after experiencing strong gains for two years, historical precedence now strongly suggests that the DRAM ASP (and market) will soon begin trending downward.  One indicator suggesting that the DRAM ASP is on the verge of decline is back-to-back years of huge increases in DRAM capital spending to expand or add new fab capacity (Figure 2). DRAM capital spending jumped 81% to $16.3 billion in 2017 and is expected to climb another 40% to $22.9 billion this year. Capex spending at these levels would normally lead to an overwhelming flood of new capacity and a subsequent rapid decline in prices.

Figure 2

However, what is slightly different this time around is that big productivity gains normally associated with significant spending upgrades are much less at the sub-20nm process node now being used by the top DRAM suppliers as compared to the gains seen in previous generations.

At its Analyst Day event held earlier this year, Micron presented figures showing that manufacturing DRAM at the sub-20nm node required a 35% increase in the number of mask levels, a 110% increase in the number of non-lithography steps per critical mask level, and 80% more cleanroom space per wafer out since more equipment—each piece with a larger footprint than its previous generation—is required to fabricate ≤20nm devices. Bit volume increases that previously averaged around 50% following the transition to a smaller technology node, are a fraction of that amount at the ≤20nm node.  The net result is suppliers must invest much more money for a smaller increase in bit volume output.  So, the recent uptick in capital spending, while extraordinary, may not result in a similar amount of excess capacity, as has been the case in the past.

As seen in Figure 2, the DRAM ASP is forecast to rise 38% in 2018 to $6.65, but IC Insights forecasts that DRAM market growth will cool as additional capacity is brought online and supply constraints begin to ease. (It is worth mentioning that Samsung and SK Hynix in 3Q18 reportedly deferred some of their expansion plans in light of expected softening in customer demand.)

Of course, a wildcard in the DRAM market is the role and impact that the startup Chinese companies will have over the next few years.  It is estimated that China accounts for approximately 40% of the DRAM market and approximately 35% of the flash memory market.

At least two Chinese IC suppliers, Innotron and JHICC, are set to participate in this year’s DRAM market. Although China’s capacity and manufacturing processes will not initially rival those from Samsung, SK Hynix, or Micron, it will be interesting to see how well the country’s startup companies perform and whether they will exist to serve China’s national interests only or if they will expand to serve global needs.

 

By Jay Chittooran

U.S. Government Imposes Tariffs on $200 Billion of Goods and China Retaliates on $60 Billion of Goods

Earlier this week, the U.S. Trade Representative (USTR) released a 10 percent tariff on $200 billion in imports from China, including more than 90 tariff lines central to the semiconductor industry.

The 10 percent tariff will take effect on September 24, 2018, and rise to 25 percent on January 1. These tariff lines will cost SEMI’s 400 U.S. members tens of millions of dollars annually in additional duties. However, counting the products included in the previous rounds of tariffs, the total estimated impact exceeds $700 million annually. China has already announced that it will respond with tariffs on $60 billion worth of U.S. goods. In his notice, President Trump said the U.S. will impose tariffs on $267 billion worth of goods if China retaliates.

The U.S. government removed 279 total tariff lines, including three lines that impact our industry: silicon carbide, tungsten, and network hubs used in the manufacturing process.

As we’ve noted, intellectual property is critical to the semiconductor industry, and SEMI strongly supports efforts to better protect valuable IP. However, we believe that these tariffs will ultimately do nothing to address the concerns with China’s trade practices. This sledgehammer approach will introduce significant uncertainty, impose greater costs, and potentially lead to a trade war. This undue harm will ultimately undercut our companies’ ability to sell overseas, which will only stifle innovation and curb U.S. technological leadership.

Product Exclusion Process – List 2

USTR formally published the details for the product exclusion process for products subject to the List 2 China 301 tariffs (the $16 billion tariff list). If your company’s products are subject to tariffs, you can request an exclusion.

In evaluating product exclusion requests, the USTR will consider whether a product is available from a source outside of China, whether the additional duties would cause severe economic harm to the requestor or other U.S. interests, and whether the product is strategically important or related to Chinese industrial programs (such as “Made in China 2025”)

The request period ends on December 18, 2018, and approved exclusions will be effective for one year, applying retroactively to August 23, 2018. Because exclusions will be made on a product basis, a particular exclusion will apply to all imports of the product, regardless of whether the importer filed a request.

More information, including the process for submitting the product exclusion request and details what information should be included in your submission can be found here.

Please let me know if your company plans on filing an exclusion. SEMI has prepared a document that includes guidelines for your exclusion filing, an explainer on how to submit, and links to official government info. SEMI is glad to assist your companies file exclusion requests for your products.

SEMI will continue tracking ongoing trade developments. Any SEMI members with questions should contact Jay Chittooran, Public Policy Manager at SEMI, at [email protected].

In its Mid-Year Update to the 2018 McClean Report, IC Insights updated its forecast of sales growth for each of the 33 major IC product categories defined by WSTS (Figure 1).  IC Insights now projects that seven product categories will exceed the 16% growth rate expected from the total IC market this year. For the second consecutive year, the DRAM market is forecast to top all IC product segments with 39% growth. Overall, 13 product categories are forecast to experience double-digit growth and 28 total IC product categories are expected to post positive growth this year, down slightly from 29 segments in 2017.

Rising average selling prices for DRAM continued to boost the DRAM market through the first half of the year and into August.  However, IC Insights believes the DRAM ASP (and subsequent market growth) is at or near its peak, as a big rise in DRAM capital expenditures for planned capacity upgrades and expansions is likely put the brakes on steep market growth beginning in 2019.

In second place with 29% growth is the Automotive—Special-Purpose Logic market, which is being lifted by the growing number of onboard electronic systems now found on new cars. Backup cameras, blind-spot (lane-departure) detectors, and other “intelligent” systems are mandated or are being added across all new vehicles—entry level to luxury—and are expected to contribute to the semiconductor content per new car growing to more than $540 per vehicle in 2018.

Wireless Comm—Application-Specific Analog is forecast to grow 23% in 2018, as the world becomes increasingly dependent on the Internet and demand for wireless connectivity continues to rise. Similarly, demand for medical/health electronics systems connectivity using the Internet will help the market for Industrial/Other Application-Specific Analog outpace total IC market growth in 2018.

Among the seven categories showing better than total IC market growth this year, three are forecast to be among the largest of all IC product categories in terms of dollar volume. DRAM (#1 with $101.6 billion in sales), NAND Flash (#2 with $62.6 billion), Computer and Peripherals—Special Purpose Logic (#4 with $27.6 billion) prove that big markets can still achieve exceptional percentage growth.

Figure 1

Global fab equipment spending will increase 14 percent this year to US$62.8 billion and is expected to rise 7.5 percent, to US$67.5 billion, in 2019, marking the fourth consecutive year of spending growth and the highest investment year for fab equipment in the history of the industry, according to the latest World Fab Forecast Report published today by SEMI. Investments in new fab construction are also nearing a record with a fourth consecutive year of growth predicted and capital outlays next year approaching US$17 billion.

Investments for fab technology and product upgrades, as well as for additional capacity, will grow as the emergence of numerous new fabs significantly increases equipment demand, the forecast shows. The World Fab Forecast Report currently tracks 78 new fabs and lines that have or will start construction between 2017 to 2020 (with various probabilities) and will eventually require more US$220 billion in fab equipment (Figure 1). Construction spending for these fabs and lines is expected to reach US$53 billion during this period.

Figure 1: Shows the investment potential of new fabs and lines starting construction between 2017 and 2020.

Korea is projected to lead other regions in fab equipment investments with US$63 billion, US$1 billion more than second-place China. Taiwan is expected to claim the third spot at US$40 billon, followed by Japan at US$22 billion and the Americas at US$15 billion. Europe and Southeast Asia will share sixth place, with investments totaling US$8 billion each. Fully 60 percent of these fabs will serve the Memory sector (the lion’s share will be 3D NAND), and a third will go to Foundry.

Of the 78 fab construction projects starting construction between 2017 and 2020, 59 began construction in the first two years (2017 and 2018), while 19 are expected to begin in the last two years (2019 and 2020) of the tracking period.

Equipping a new fab typically takes one to one and a half years, though some fabs take two years and others longer, depending on various factors as such the company, fab size, product type and region. Approximately half of the projected US$220 billion will be spent from 2017 and 2020, with less than 10 percent invested in 2017 and 2018, nearly 40 percent in 2019 and 2020, and the rest after 2020.

While the US$220 billion estimate is based on current insights of known and announced fab plans, total spending could exceed this level as many companies continue to announce plans for new fabs. Since the last quarterly publication of the report published last quarter, 18 new records – all new fabs – have been added to the forecast. Up-to-date and detailed analysis, with a bottoms-up approach, is available by subscribing to SEMI’s World Fab Forecast Report.

Since its June 1 publication, more than 340 updates have been made to the World Fab Forecast. The report now includes more than 1,200 records of current and future front-end semiconductor facilities from high-volume production to research and development. The report covers data and predictions through 2019, including milestones, detailed investments by quarter, product types, technology nodes and capacities down to fab and project level.

Learn more about the SEMI fab databases at www.semi.org/en/MarketInfo/FabDatabase and www.youtube.com/user/SEMImktstats.