Tag Archives: letter-pulse-business

The SEMI Foundation today announced that its flagship High Tech U (HTU) program received the Innovative Program Award at the High Impact Technology Exchange Conference (HI-TEC).  The Innovative Program Award recognizes advanced technology education professionals that have designed and implemented a significant innovation, which has led to a positive impact on student enrollment, retention, or advanced technological education. The HI-TEC event and award are sponsored by a consortium of National Science Foundation-funded centers and projects.

“We are honored that SEMI High Tech U has been recognized by stakeholders in the National Science Foundation’s Advanced Technological Education (ATE) workforce programs,” said Leslie Tugman, executive director of the SEMI Foundation.  “It has been very rewarding to work with our industry partners to emphasize the importance of STEM skills and inspire young people to pursue careers in high technology fields. Seventy percent of HTU alumni graduate college with STEM degrees and work in STEM careers.”

“The SEMI Foundation is a leader in the delivery of hands-on, STEM-based, career exploration programs,” said Michael Lesiecki, Ph.D., executive director and principal investigator for the Maricopa Advanced Technology Education Center (MATEC) and ATE member. “Leslie’s work at the SEMI Foundation in 2001 to bring this model to industry partners has developed over time to become a standard of excellence in early workforce development.”

The nonprofit SEMI Foundation has delivered SEMI High Tech U to more than 6,000 students at SEMI member industry facilities in eleven U.S. states and nine countries internationally since 2001. The three-day interactive program brings students onto industry sites where industry instructors teach the HTU modules. This unique delivery system enables students to meet engineers and industry personnel in a face-to-face setting. HTU motivates students by showing them the relevance of their classwork through connections to real-world problems and technology. For their latest Impact Report, visit: www.semifoundation.org/impact-report

Sponsored by a consortium of National Science Foundation Advanced Technological Education centers and projects, HI-TEC is a national conference that presents postsecondary and secondary educators and stakeholders with professional development, educational materials, collaborative ventures, and insights essential to developing and advancing the technical workforce of the 21st century.

 

A major bottleneck in the commercialization of Micro LED displays is the mass transfer of micron-size LEDs to a display backplane. Research by LEDinside, a division of TrendForce, reveals that many companies across industries worldwide have entered the Micro LED market and are in a race to develop methods for the mass transfer process. However, their solutions have yet to meet the standard for commercialization in terms of production output (in unit per hour, UPH), transfer yield and size of LED chips (i.e. Micro LED is technically defined as LEDs that are smaller than 100 microns). These research findings can be found in LEDinside’s 3Q17 Micro LED Next Generation Display Industry Member Report: Analyses on Mass Transfer and Inspection/Repair Technologies.

Currently, entrants in the Micro LED market are working towards the mass transfer of LEDs sized around 150 microns. LEDinside anticipates that displays and projection modules featuring 150-micron LEDs will be available on the market as early as 2018. When the mass transfer for LEDs of this size matures, market entrants will then invest in processes for making smaller products.

Development of mass transfer solutions faces seven major challenges

“Mass transfer is one of the four main stages in the manufacturing of Micro LED displays and has many highly difficult technological challenges,” said Simon Yang, assistant research manager of LEDinside. Yang pointed out that developing a cost-effective mass transfer solution depends on advances in seven key areas: precision of the equipment, transfer yield, manufacturing time, manufacturing technology, inspection method, rework and processing cost.

LED suppliers, semiconductor makers and companies across the display supply chain will have to work together to develop specification standards for materials, chips and fabrication equipment used in Micro LED production. Cross-industry collaboration is necessary since each industry has its own specification standards. Also, an extended period of R&D is needed to overcome the technological hurdles and integrate various fields of manufacturing.

Mass transfer has to achieve five-sigma level before mass production of Micro LED displays is feasible

Using Six Sigma as the model for determining the feasibility of mass production of Micro LED displays, LEDinside’s analysis indicates that the yield of the mass transfer process must reach the four-sigma level to make commercialization possible. However, the processing cost and the costs related to inspection and defect repair are still quite high even at the four-sigma level. To have commercially mature products with competitive processing cost available for market release, the mass transfer process has to reach the five-sigma level or above in transfer yield.

As progress on mass transfer solutions continues, true Micro LED products are expected to first enter applications such as indoor displays and wearables

Even though no major breakthroughs have been announced, many technology companies and research agencies worldwide continue to invest in the R&D of mass transfer process. Some of the well-known international enterprises and institutions working in this area are LuxVue, eLux, VueReal, X-Celeprint, CEA-Leti, SONY and OKI. Comparable Taiwan-based companies and organizations include PlayNitride, Industrial Technology Research Institute, Mikro Mesa and TSMC.

There are several types of mass transfer solutions under development. Choosing one of them will depend on various factors such as application markets, equipment capital, UPH and processing cost. Additionally, the expansion of manufacturing capacity and the raising of the yield rate are important to product development.

According to the latest developments, LEDinside believes that the markets for wearables (e.g. smartwatches and smart bracelets) and large indoor displays will first see Micro LED products (LEDs sized under 100 microns). Because mass transfer is technologically challenging, market entrants will initially use the existing wafer bonding equipment to build their solutions. Furthermore, each display application has its own pixel volume specifications, so market entrants will likely focus on products with low pixel volume requirements as to shorten the product development cycle.

Thin film transfer is another away of moving and arranging micron-size LEDs, and some market entrants are making a direct jump to developing solutions under this approach. However, perfecting thin film transfer will take longer time and more resources because equipment for this method will have to be designed, built and calibrated. Such an undertaking will also involve difficult manufacturing related issues.

The global active-matrix organic light-emitting diode (AMOLED) panel market is forecast to surge 63 percent in 2017 from a year ago to $25.2 billion on growing demand for AMOLED panels in the smartphone and TV industries, according to IHS Markit (Nasdaq: INFO).

“Growing use of AMOLED panels in smartphones and rising sales of AMOLED TVs will mainly drive the growth of the AMOLED panel market,” said Ricky Park, director of display research at IHS Markit. “A steady rise in demand from head-mount displays and mobile PCs would also prop up the market.”

AMOLED_shipment_revenue_forecast_2

The demand for AMOLED displays has rapidly risen in the smartphone market in particular as the flexible substrate allows phones to be produced in various designs with a lighter and slimmer bodies. This year, leading smartphone makers have competitively rolled out premium phones that boast a very narrow bezel or nearly bezel-less designs.

“The AMOLED display market is also expected to get a boost from Apple’s decision to use an AMOLED screen in its iPhone series to be released later this year, and Chinese smartphone makers’ moving to newer applications of AMOLED panels,” Park said. “To meet the burgeoning demand, South Korean and Chinese display makers have been heavily investing in Generation 6 AMOLED fabs.”

According to Display Long-term Demand Forecast Tracker from IHS Markit, the TV industry, the second biggest market for AMOLED panels, will also play a major role in fostering the growth of the AMOLED panel market this year. LG Display, which currently dominates the AMOLED TV panel market, is set to embark on the operation of its second AMOLED TV panel line E4-2 with an aim to mass produce panels in the latter half of this year.

Bumped up by an increase in output, the AMOLED TV panel market is forecast to grow from 890,000 units last year to 1.5 million units this year. By 2021, the AMOLED panel market is projected to expand at a compound annual growth rate of 22 percent to exceed $40 billion.

Texas Instruments Incorporated (TI) (NASDAQ: TXN) today announced that Brian T. Crutcher has been named to its board of directors. Mr. Crutcher is executive vice president and chief operating officer of TI.

“Brian is a great addition to our board,” said Rich Templeton, TI’s chairman, president and CEO. “He knows TI well and brings strong financial acumen and business judgment to the board.”

Crutcher, 44, joined TI in 1996 and has critical leadership responsibility for TI’s businesses, sales and manufacturing organizations. He was named a senior vice president in 2010, executive vice president in 2014 and chief operating officer in early 2017. Brian holds a Bachelor of Science in electrical engineering from the University of Central Florida and a Master of Business Administration from the University of California, Irvine.

“Brian’s 20-plus years of leading large, complex semiconductor operations gives him keen insights into the current and future state of this industry. His knowledge of markets and customers will be valuable to the board’s deliberations,” said Wayne Sanders, the TI board’s lead director and chairman of its governance and stockholder relations committee.

Taiwan is the world’s largest consumer of semiconductor materials for the seventh consecutive year, bringing new opportunities in this increasingly critical sector.  SEMICON Taiwan (13-15 September), held at Taipei’s Nangang Exhibition Center, will feature over 1,700 booths and 700 exhibitors, and more than 45,000 attendees from the global electronics manufacturing supply chain. This year, in addition to the much-anticipated Executive Summit, themed “Transformation: A Key to Solution,” 27 international forums will be held, exploring major issues. Speakers from TSMC, UMC, Powerchip, NVIDIA, Micron and Amkor will share their insights on trends and strategies of the next-generation electronics industry.

According to the SEMI Material Market Data Report, Taiwan’s semiconductor materials consumption was US$9.8 billion in 2016 − the world’s largest. Global semiconductor manufacturing equipment billings reached US$13.1 billion in Q1 2017, exceeding the record quarterly high set in Q3 2000. These figures signal that application drivers will continue to drive the development of a supply chain feeding their manufacturing processes, equipment and materials.

“As SEMICON Taiwan celebrates its 22nd year, the exhibition area will be expanded to closely align with the four major trends of applications in the market, which include Internet of Things (IoT), Smart Manufacturing, Smart Transportation, and Smart Medtech,” said Terry Tsao, president of SEMI Taiwan. “This year, SEMICON Taiwan aims to increasingly connect the entire manufacturing ecosystem vertically and horizontally. In addition, it will provide an overview of market trends and leading technologies in the industry, with forums and business matching activities which will enable collaboration and new opportunities.”

Theme Pavilions and Region Pavilions Focus on Opportunities

In addition to the eight customary theme pavilions, five new pavilions are featured this year, and to promote cross-border collaboration, eight regional pavilions are offered. The 21 pavilions include:

Theme Pavilions
  • Automated Optical Inspection (AOI)
  • Chemical Mechanical Planarization (CMP)
  • High-Tech Facility
  • Materials
  • Precision Machinery
  • Secondary Market
  • Smart Manufacturing & Automation
  • Taiwan Localization

 
New Theme Pavilions
  • Circular Economy
  • Compound Semiconductor
  • Flexible Hybrid Electronics/Micro-LED
  • Laser
  • Opto Semiconductor

 
Regional Pavilions
  • Cross-Strait
  • German
  • Holland High-Tech
  • Korean
  • Kyushu (Japan)
  • Okinawa (Japan)
  • Silicon Europe
  • Singapore

Co-located with SEMICON Taiwan 2017, the SiP Global Summit will discuss three key system-in-package topics:

  • Package Innovation in Automotive
  • 3D IC, 3D interconnection for AI and High-end Computing
  • Innovative Embedded Substrate and Fan-Out Technology to Enable 3D-SiP Devices

Participants will share trends on 2.5D/3D IC technologies, and the evolution and challenges of embedded technologies and wafer level packaging.

This is the first year that the International Test Conference (ITC) will be co-located with SEMICON Taiwan 2017, also marking the first time that ITC is held in Asia. The conference will focus on the rapid growth of emerging applications like IoT and automotive electronics, and how testing technologies are challenged by rapid advancements of manufacturing processes, 3D stacking and SiP.

For more information about SEMICON Taiwan 2017, please visit www.semicontaiwan.org or follow us on Facebook.

The American Institute for Manufacturing Integrated Photonics (AIM Photonics), a public-private partnership advancing the nation’s photonics manufacturing capabilities, announced Mentor, a Siemens Business and global EDA leader, as the newest Tier 1 member of AIM Photonics. Mentor brings its expertise in Electronic Photonics Design Automation (EPDA), a critical design technology enabler for AIM Photonics’ Process Design Kit (PDK) and Multi Project Wafer (MPW).

Mentor’s software and hardware design solutions enable companies to develop better electronic products faster and more cost-effectively.  These solutions will help engineers in AIM Photonics and member companies overcome design challenges in the increasingly complex world of board and chip design, especially as it relates to integrated silicon photonics.

“AIM Photonics has built an integrated photonics design solution package that is second to none, mainly due to the membership of global electronic design leaders like Mentor,”  said  Dr. Michael Liehr, CEO of AIM Photonics. “Their expertise in functional verification, design for test, and PCB design are a plus for our new Test, Assembly, and Packaging (TAP) facility now under construction.”

“Mentor’s goal in joining AIM is to unify the electronic and photonic design processes so that custom IC designers can be successful with their photonic IC designs,” said Robert Hum, vice president, Deep Sub Micron Division at Mentor. “We are enhancing our Pyxis®-based custom design flow to achieve this goal. The photonic design flow also includes Eldo®, Questa® ADMS and Calibre® for verification.”

Since fall of 2016 AIM Photonics has released a number of versions and updates to its PDK, in support of its MPW program and third call for proposals. Mentor also recently presented on PIC Design for AIM MPW at the AIM Photonics Proposer event in Rochester, NY. Since then, numerous commercial, government, and university organizations have signed up to participate in the PDK and MPW programs.

In a recent announcement, Mentor provided details on a new integration with PhoeniX Software, also an AIM Photonics EPDA Member, that reduces tape-out time for integrated photonics designers by enabling faster iterations between final sign-off verification and the design tool. Designers using the new integration will be able to more quickly identify and correct layout issues to ensure their designs comply with manufacturing requirements.

“The exceptional response to our PDK and MPW offerings is a testament to what Mentor brings to AIM Photonics’ EPDA program,” said Brett Attaway, AIM Photonics EPDA Executive Director.  “The fantastic synergy between AIM’s EPDA members has been instrumental in bringing new integrated photonic design solutions to the market quickly.”

 

Durcan_Mark_2400x3000_1_smlThe Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, announced Mark Durcan, former CEO of Micron Technology, Inc., and a longtime leader in advancing semiconductor technology, has been named the 2017 recipient of SIA’s highest honor, the Robert N. Noyce Award. SIA presents the Noyce Award annually in recognition of a leader who has made outstanding contributions to the semiconductor industry in technology or public policy. Durcan, who retired as Micron CEO on May 8, 2017, will accept the award at the SIA Annual Award Dinner on Tuesday, Nov. 14, 2017 in San Jose, an event that will also commemorate SIA’s 40th anniversary.

“Throughout his impressive career, Mark Durcan has demonstrated the best the semiconductor industry has to offer: hard work, ingenuity, and a relentless focus on promoting innovation,” said John Neuffer, president and CEO, Semiconductor Industry Association. “From his engineering roots to his recent work leading one of the world’s top manufacturers of memory products, Mark has strengthened our industry, advanced semiconductor technology, and reinforced America’s leadership of the global semiconductor market. On behalf of the SIA board of directors, it is a pleasure to announce Mark’s selection as the 2017 Robert N. Noyce Award recipient in honor of his outstanding accomplishments.”

A 30-year company veteran, Durcan rose from his first role as a Process Integration Engineer to Chief Technical Officer, President, and, ultimately, CEO in 2012. A key technical decision maker in bringing Micron’s next-generation technologies to market, Durcan expanded Micron’s global presence and enhanced its capabilities with strategic acquisitions, including Elpida (2012) and Rexchip (2012) and Inotera Memories, Inc. (2016). He also forged long-lasting partnerships with industry leaders such as Intel.

Durcan served as Chairman of the Micron Technology Foundation, Inc., which was formed to advance STEM education and support civic and charitable institutions in the communities in which Micron has facilities. He also currently serves on the board of directors for AmerisourceBergen Corp. and St. Luke’s Health System, a non-profit hospital system in Idaho. Durcan earned both bachelor’s and master’s degrees in chemical engineering from Rice University.

“It is a true honor to be selected for this award, and to join the ranks of its distinguished recipients, who are industry pioneers and icons,” said Durcan. “Nothing that I have accomplished during my career would have been possible without the influence of so many innovative and dedicated colleagues at Micron as well as our customers, suppliers, and partners. It is with sincere appreciation for their contributions to our industry that I gratefully accept this award.”

The Noyce Award is named in honor of semiconductor industry pioneer Robert N. Noyce, co-founder of Fairchild Semiconductor and Intel.

The Semiconductor Industry Association (SIA), in consultation with the Semiconductor Research Corporation (SRC), today announced the winners of its 2017 University Research Award: Dr. Gabor C. Temes, professor of electrical and computer engineering at Oregon State University (OSU), and Dr. Sanjay Banerjee, professor of electrical and computer engineering and director of the Microelectronics Research Center at The University of Texas at Austin (UT Austin). Drs. Temes and Banerjee will receive the awards in conjunction with the SIA Annual Award Dinner on Nov. 14, 2017 in San Jose, Calif.

“Research is at the root of all innovation, breathing life into new technologies that have strengthened our industry, spurred economic growth, and improved people’s lives,” said John Neuffer, president and CEO of SIA, which represents U.S. leadership in semiconductor manufacturing, design, and research. “Throughout their careers, Professors Temes and Banerjee have epitomized excellence in scientific research, leading efforts to advance semiconductor technology and strengthen America’s technological leadership. We are pleased to recognize Dr. Temes and Dr. Banerjee for their groundbreaking achievements.”

Neuffer also highlighted the importance of government investments in basic research funded through agencies like the National Science Foundation (NSF) and the National Institute of Standards and Technology (NIST) and applauded recently announced public-private initiatives at the U.S. Department of Energy and the Defense Advanced Research Projects Agency (DARPA) aimed at advancing semiconductor research. He expressed SIA’s readiness to work with the Trump Administration and Congress to ensure enactment of a fiscal year 2018 budget that prioritizes investments in basic research.

“The University Research Award was established to recognize lifetime achievements in semiconductor research by university faculty,” said Ken Hansen, president & CEO of SRC. “Drs. Temes and Banerjee have repeatedly advanced the state-of-the-art semiconductor design and technology in their respective fields. These esteemed professors’ influence on their students has produced new leaders and contributors in the semiconductor industry. The research output from the cooperative universities plays an integral role in next-generation innovations. It is with great appreciation and admiration that the entire SRC team congratulates Dr. Temes and Dr. Banerjee.”

Dr. Temes will receive the honor for excellence in design research. In particular, he will be recognized for contributions in interface electronics, including analog-to-digital and digital-to-analog converters, switched-capacitor filters and amplifiers, and sensor interfaces. Before joining OSU, Dr. Temes held academic positions at the Technical University of Budapest, Stanford University, and UCLA. He also worked in industry at Northern Electric R&D Laboratories (now Bell-Northern Research), as well as at Ampex Corp. Dr. Temes received his undergraduate education at the Technical University and Eotvos University in Budapest, Hungary, and his Ph.D. in electrical engineering from University of Ottawa, Canada.

Dr. Banerjee will receive the award for excellence in technology research. Specifically, he will be honored for contributions in MOS and nanostructure device modeling, Si-Ge-C heterostructure devices, and ultra-shallow junction technology. Before joining the Cockrell School of Engineering at UT Austin, Dr. Banerjee was at Texas Instruments from 1983-1987, where he worked on polysilicon transistors and dynamic random access trench memory cells used by Texas Instruments in the world’s first 4Megabit DRAM. He received his undergraduate degree from the Indian Institute of Technology, Kharagpur, and his M.S. and Ph.D. from the University of Illinois at Urbana-Champaign, all in electrical engineering.

MagnaChip Semiconductor Corporation (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications, announced today it was selected as a foundry partner by ELAN Microelectronics to manufacture the world’s first fingerprint sensor IC-based smartcard. The smartcard uses biometrics technology that provides secure identification to prevent credit card fraud, a severe and growing problem globally. The sensor-IC based smartcard will be manufactured utilizing MagnaChip’s 0.35 micron Mixed Signal Thick IMD manufacturing process technology.

The requirement for more precise, efficient and low-power ICs has increased dramatically, coinciding with the rise in importance of biometrics technology for a range of applications.  Industry analyst Frost & Sullivan forecasts that the biometrics industry will grow at a CAGR of 17.4% from 2014 to 2019 and that fingerprint-based sensor ICs will comprise 66% of the market.

MagnaChip was selected as ELAN’s foundry partner primarily because of the company’s recognized specialized foundry capability, proven and reliable manufacturing processes with robust analog  performance. MagnaChip’s current technologies for fingerprint sensor ICs include 0.35 micron, 0.18 micron 1.8V/3.3V and single 3.3V Mixed Signal technology processes. MagnaChip plans to expand its portfolio of manufacturing processes to include more advanced technologies such as its highly competitive 0.18 micron Slim Mixed Signal manufacturing process, which requires fewer mask layers than usual. MagnaChip’s manufacturing processes are well-suited for applications in fast-growing markets that require fingerprint identification, such as in the payment, medical, transportation and automobile industries.

“We hope that the collaboration between MagnaChip and ELAN will continue to produce innovative and high quality products for our customers,” said I. H. Yeh, ELAN’s Chief Executive Officer. “ELAN sees its continued strategic partnership with MagnaChip as a long-term benefit to ELAN and MagnaChip.”

YJ Kim, Chief Executive Officer of MagnaChip, commented, “We are very pleased to announce MagnaChip’s continued partnership with ELAN and the volume ramp of fingerprint sensor IC-based products utilizing our 0.35 micron Mixed Signal Thick IMD based process technology. This process is well-suited for smartcards, which require low power consumption. We will continue to develop high-performance and cost-effective fingerprint sensor IC technology solutions that meet the growing needs of our foundry customers.”

Applied Materials, Inc. today recognized 10 companies with Supplier of the Year Awards for their contributions to Applied’s success over the past year. The awards reflect outstanding performance in several areas including quality, service, lead time, delivery, cost and sustainability. The awards were presented at Applied’s annual Executive Supplier Forum, an event highlighting the company’s commitment to build close relationships with suppliers, communicate Applied’s strategic direction and priorities, and foster supplier engagement.

“Technology advancements in semiconductors and displays are progressing at an astounding rate,” said Gino Addiego, senior vice president of Engineering, Operations and Quality at Applied Materials. “As the innovation leader, Applied works closely with its suppliers to achieve superior technical and operational performance. I want to thank all the 2017 Supplier of the Year Award winners for contributing to Applied’s success in delivering industry-leading products.”

The following companies received Supplier of the Year Awards in their designated categories for consistently meeting or exceeding Applied’s performance expectations over the past year:

OEM Supplier
Green, Tweed & Co.
Sinfonia Technology

Contract Manufacturing
Foxsemicon Integrated Technology Inc.

Component Manufacturing
Rapid Manufacturing

Precision Machining
Paradigm Metals Inc.

Advanced Materials
Ferrotec Corporation

Special Processes
LeanTeq

Aftermarket Excellence
Coherent

Information Technology
Ping Identity

Collaboration and Innovation
Comet AG, Plasma Control Technologies