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TOUCH TECHNOLOGIES ARTICLES



Capacitive touch controller IC market to grow at double-digit CAGR until 2017

07/16/2014  The capacitive touch controller IC market is predicted to reach about $2.8 billion in 2017, an increase of nearly 50 percent from $1.9 billion in 2013, according to a new report from IHS Technology.

Renasas Electronics announces development of new capacitive-touch sensing technology

07/16/2014  Renesas Electronics America Inc., a supplier of advanced semiconductor solutions, today announced development of innovative new intellectual property (IP) that implements capacitive-touch sensing technology ideal for home appliances and healthcare equipment.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isn’t slowing down. But its steady acceleration isn’t happening spontaneously, and Tuesday’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.

The Connected Experience: A Manufacturer’s Dream?

07/09/2014  Imagine being able to not only track and address equipment degradation in real time, but also analyze patterns in your factories’ equipment and address potential issues before they even present a problem. It may sound too good to be true, but Microsoft’s Sanjay Ravi explained in Wednesday morning’s keynote that this innovation is becoming available now to manufacturers.

Trends in Next-Generation MEMS Discussed in TechXPOT Forum

07/09/2014  The microelectromechanical system (MEMS) device market is forecast to increase at a compound annual growth rate of 13 percent over the next five years, reaching $24 billion in 2019, according to Jean-Christophe Eloy, president and CEO of Yole Développement.

The End of Scaling?

07/09/2014  Are we reaching the end of scaling? Yes and no. Let me explain.

New Materials Provide Innovation Yet Add Complexity

07/09/2014  If semiconductor materials had a personal Facebook page, its status would be: It’s Complicated.

Standards Industry Leaders Honored at SEMICON West 2014

07/09/2014  SEMI honored eight industry leaders for their outstanding accomplishments in developing standards for the microelectronics and related industries. The annual SEMI Standards awards were announced at the SEMI Standards reception held during SEMICON West 2014.

The Future Looks Incredible, But Not If We Stay The Same

07/09/2014  Micron President Mark Adams’ keynote on Tuesday morning at SEMICON West 2014 was both optimistic and challenging, perhaps even unsettling for companies unused to evolving with the times.

FinFETs and FDSOI Provide Options

07/08/2014  Everybody loves FinFETs! Well, not everybody, really, is behind double-gate or multiple-gate field-effect transistors.

EUV: Coming but Not Here Yet

07/08/2014  Extreme-ultraviolet lithography is making progress! Well, check that. EUV technology is progressing, yet it remains uncertain when its insertion into volume production of semiconductors will occur.

3DICs Have Finally Arrived

07/08/2014  Intel, Samsung Electronics, and Taiwan Semiconductor Manufacturing have made their moves into three-dimensional semiconductors. Now it remains to be seen how the rest of the semiconductor industry will make the transition to 3DICs.

First 450mm Wafers Patterned with Immersion Lithography Displayed

07/08/2014  A collection of the first fully patterned 450mm wafers are on display at SEMICON West this week at the newly merged SUNY CNSE/SUNYIT exhibit, booth 517, located in the Moscone Center’s South Hall. The wafers will be on display throughout the exhibition and showcased in the 450 mm Technology Development Session on Thursday July 10th.

Sunny prospects await photovoltaics in 2014

07/08/2014  The long night in solar energy may be coming to an end.

What's next for semiconductor packaging?

07/08/2014  With mobile devices continuing to shrink in size and wearable electronics emerging as a new market for semiconductors, advanced packaging technologies are taking on increasing importance in the global supply chain. Aside from the 3DIC package/system-in-package area, what is going on in semiconductor packaging these days?

FinScale’s Quantum FinFET Aims to Revive Moore’s Law

07/07/2014  FinScale Incorporated, the semiconductor device and process innovation company, today announced immediate availability of its qFinFETTM technology, a next generation 3D MOSFET architecture and manufacturable process readily transferable to foundries and integrated device manufacturers

SEMI Announces Results of Board Elections and Leadership Appointments

07/07/2014  SEMI today announced that Martin Anstice, president and CEO, Lam Research Corporation; Kevin Crofton, president and COO, SPTS Technologies; Tien Wu, COO, ASE Group; and Guoming Zhang, executive vice president, Sevenstar Electronics, were elected as new directors to the SEMI International Board of Directors in accordance with the association's by-laws.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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