Wafer Processing

WAFER PROCESSING ARTICLES



Motorola delays mass wafer production in China

08/05/2002  Aug. 5, 2002 - Beijing, China - US telecommunications equipment maker Motorola Inc. has delayed plans to begin mass wafer production in China to the second half of this year, a company spokeswoman said.

What a difference two years makes:
MEMSCAP to buy former Cronos for $10M


08/02/2002  France-based MEMSCAP said Thursday it will buy JDS Uniphase's MEMS Business Unit in a stock deal valued at about $10 million - the very same unit JDSU acquired in 2000 for stock worth $750 million. At least half of the unit's 80 employees are expected to get pink slips, as machinery is moved from North Carolina to Bernin, France.

TSMC Fab 12 gets risk management and ISO certifications

08/01/2002  AUG. 1--HSIN-CHU, TAIWAN--Taiwan Semiconductor Manufacturing Co.'s 300 mm Fab 12 has been certified in risk, environmental and safety management by completing the AAA Damage Prevention and Fire Safety, the ISO 14001 and the OHSAS 18001 certification protocols

Hoya to start SiC wafer biz

08/01/2002  Tokyo, Japan - Hoya Corp., an advanced glass products manufacturer, plans to establish a new company, Hoya Advanced Semiconductor Technologies Co. Ltd., at Akishuma-shi, Tokyo, for the development and production of silicon carbide wafers.

Packaging of Cu/low-k Addressed at IITC

08/01/2002  The annual International Interconnect Technology Conference (IITC) added advanced packaging as one of its focus topics this year

SEMI symposium spotlights advances in materials technology

07/29/2002  July 29--San Jose, CA--The latest development in semiconductors materials and the outlook for the materials market will be the focus of the third annual SEMI Microelectronic Materials Strategy Symposium in September.

TSMC cuts capex

07/25/2002  Hsinchu, Taiwan - Taiwan Semiconductor Manufacturing Co. (TSMC) posted weaker-than-expected quarterly profits and surprised investors by forecasting things would get worse in the July-September period.

AMCC announces work force reduction

07/23/2002  San Diego, CA - Applied Micro Circuits Corp. reported its financial results for 1Q03, and announced a work force reduction, by which it expects to reduce headcount by approximately 275 employees, or about 25%, from the level of March 2002.

Rudolph Technologies enters defect market; Acquires ISOA

07/23/2002  July 23, 2002 - Flanders, NJ - Rudolph Technologies Inc., a provider of process control metrology systems, has entered into a definitive agreement to acquire privately held ISOA, a defect control company based in Richardson, TX.

New Zurich nanotech lab will help advance industry

07/23/2002  A nano and microtechnology facility called FIRST – an acronym for Frontiers in Research, Space and Time – opened this month at the Swiss Federal Institute of Technology in Zurich. The first concrete products to emerge will be active photonic components, according to officials at GigaTera Inc., which is involved in one of the industrial/academic partnerships meant to commercialize research at the lab.

IBM, ILS Technology form strategic alliance

07/22/2002  July 22, 2002 - White Plains, NY, and Boca Raton, FL - IBM and ILS Technology LLC (a Park-Ohio Holdings company), have formed a non-exclusive strategic alliance to deliver e-diagnostics solutions for the worldwide semiconductor industry.

Microchip Technology signs definitive agreement to acquire fab

07/18/2002  July 18, 2002 - Gresham, OR - Microchip Technology Inc., Chandler, AZ, has executed an agreement to acquire a semiconductor manufacturing complex in Gresham, OR, from Fujitsu Microelectronics Inc. for $183.5 million in cash.

Semiconductor equipment markets to stage gradual recovery

07/18/2002  San Jose, CA - The recovery in the semiconductor market will be gradual; technology innovation continues unabated; and China is expected to play an increasingly important supply and demand role. These views were expressed by senior executives who participated in a panel discussion during a manufacturing segment of SEMICON West 2002, which opened July 17 at the San Jose Convention Center.

SEMATECH and U. at Albany-SUNY to form strategic alliance

07/18/2002  Austin, TX, and Albany, NY - Plans for a joint five-year $320 million program to accelerate the development of next generation lithography were announced by International SEMATECH (ISMT), a global consortium of semiconductor manufacturers, and the U. at Albany-SUNY (UAlbany).

Transparent Networks moves to new HQ

07/17/2002  July 17, 2002 - Milpitas, CA - Transparent Networks Inc., a developer of intelligent photonic switching systems, has expanded and relocated its headquarters from Santa Clara to Milpitas, CA.

Virtual Silicon teams with 1st Silicon for IP

07/16/2002  July 16, 2002 - Sunnyvale, CA - Virtual Silicon Technology Inc., a supplier of semiconductor IP, has received an order from 1st Silicon, Malaysia's largest wafer foundry, to port its semiconductor IP to 1st Silicon's 0.18-micron process technology.

Metrology: Quick and dirty Tevet style

07/16/2002  In the expensive and complicated world of integrated metrology, a different approach could get customers interested in a concept that may work better - while also being cheaper, simpler, and less intimidating.

Semitool, Ashland take team approach to wet chemical processing

07/16/2002  July 16--DUBLIN, Ohio -- Ashland Specialty Chemical Co., a division of Ashland Inc., and Semitool, Inc. have agreed to work jointly on innovation and process improvement in wet chemical processing for semiconductor manufacturing.

Nanometrics introduces 300mm stage technology

07/11/2002  July 11, 2002 - Milpitas, CA - Nanometrics Inc., a supplier of integrated and standalone metrology equipment, has introduced its next-generation stage technology platform.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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