Water pump for semiconductor metal etch processing
CTI-Cryogenics, Helix Technology Corp. has designed a waterpump to decrease particulate formation during semiconductor metal etch processing. Mounted in etch loadlocks and transfer chambers, the On-Board Waterpump removes water vapor at the source–from the atmosphere during wafer load and unload, and from outgassing wafers. Trapping incoming water vapor has been shown to decrease the water level in the process chamber by 99 percent, according to the company. The On-Board Waterpump`s control system provides process control, and monitoring, preventative maintenance, networked pump management and compatibility with other On-Board vacuum pumps. The pumps are available for sputtering, deposition and etch systems, optical coaters, loadlocks and other vacuum applications requiring high water vapor pumping speed.
CTI-Cryogenics, Mansfield, MA (508) 337-5000