CMP Cleaning Gets a Boost
Chandler, AZ–SpeedFam Corp. has developed “Capella,” a wafer cleaner for post-chemical mechanical polishing (CMP) applications. Typically, semiconductor manufacturers utilize one post-CMP wafer cleaner system for every three CMP heads. SpeedFam claims the figure can be increased to between five to six CMP heads per system by using the new tool`s dual-cassette load/unload stations, dual non-contact hydroplaned rinse rings and dual high-speed spin dryers within a 21-ft2 footprint. The Capella was designed with double-sided PVA brush scrubbers with in-situ chemical dispersion, non-contact wafer transport mechanisms, and a proprietary non-contact hydroplaning rinse ring concept to achieve continuous reduction of particles and defects.