TSMC Taps ADP Fluor Daniel for First U.S. fab
Tucson, AZ–ADP Fluor Daniel has signed design, procurement services, and construction management contracts for Taiwan Semiconductor Manufacturing Company`s (TSMC) first fab outside Taiwan. The project, named wafertech, is a joint venture between TSMC, Analog Devices, Inc., Altera Corp., and Integrated Silicon Solution, Inc. Ground was broken on July 11 at Camas, WA for the $225 million fab. At 500,000 ft2, the fab will ultimately produce 25,000 8-in. wafers per month by the end of 1999. The new facility will be the first semiconductor foundry manufacturing facility in the U.S.