Fab Fire Erupts in Cleanroom
Hsinchu, Taiwan–Work on Winbond Electronics Corp.`s Fab 3 in Hinschu, Taiwan has been disrupted by a fire that caused damage to the fab building and some process equipment. The blaze was said to have begun in a fourth floor cleanroom equipment maintenance area, however, U.S. officials could not confirm these accounts.
Taiwanese newspaper accounts estimated damage at up to 1.2 billion Taiwan dollars (US$43.63 million), but Winbond officials in the U.S. could not confirm this.
The blaze, which caused no injuries, will delay startup of the 25,000 wafer per month, 8-in. fab by an as-yet undetermined time. Pilot production was already underway, and volume production was to have begun in the first quarter of 1997. Current customers, all of whose products are being run in Fabs 1 and 2, will not be affected, said Winbond.
The company said it is insured for the damage to buildings and equipment.
Articles in the Taiwan Economic Journal said the fire started at about 12:50 p.m. on October 14, and was brought under control about 5 p.m.
In addition to Fab 3, Winbond is also at work on its Fab 4, which will handle cooperative production with Toshiba. Fab 3 will be a foundry.
Editor`s Note: This article first appeared in Wafer News Confidential, a sister magazine of CleanRooms. n