New CVD film extends life of tungsten silicide-based manufacturing processes

Tokyo, Japan–Genus, Inc. (Sunnyvale, CA) has introduced a new proprietary dicholorosilane (DCS) chemical vapor deposition (CVD) film that can extend the life of tungsten silicide-based manufacturing processes. The CVD film was introduced at Semicon Japan in December. Dubbed LRS for its low resistance, low-stress capabilities, the new CVD film offers improved adhesion and 20 percent lower sheet resistance after anneal than standard DCS films. LRS also enables tungsten silicide-based processing of advanced devices into the 0.18-micron generation. “As semiconductor devices continue to get smaller and faster, tungsten silicide films are being challenged because of their high sheet resistance,” says Patrice Geraghty, director of product marketing at Genus “The LRS technology enables manufacturers to use thinner polysilicide films to avoid this problem.”