PRIs latest tools meet new I300I guidelines

PRI`s latest tools meet new I300I guidelines

Billerica, MA–PRI Automation, Inc.`s Intra-Tool Buffering (ITB) system meets new material handling guidelines from the International 300 mm Initiative–an international consortium formed to facilitate the semiconductor industry`s transition to 300 mm wafer processing. Known as I300I, the consortium issued a recommendation for Lot Buffering in 300 mm wafer semiconductor fabs to ensure continuous operation of fab equipment. According to Frank Robertson, vice president and general manager of the I300I Initiative, the 13 consortium participants are cooperating to define guidelines that will ease the transition to 300 mm wafer processing and ensure the capability to implement 300 mm at the right time for the industry. “I300I member companies have asked all tool suppliers to integrate lot buffers to ensure non-stop operation of fab equipment,” says Robertson.

PRI`s President and COO Mitch Tyson noted that at least one major semiconductor manufacturer has already informed process tool manufacturers that all tools must be capable of buffering as much as one-hour`s worth of work-in-process. “PRI began development of the Intra-Tool Buffering concept two years ago, when it became apparent that 300 mm fabs would need to increase tool utilization dramatically to offset higher costs for process tools and fab construction,” says Tyson. “I300I`s recommendations further validated the need for ITB technology, which we expect will be widely deployed in 300 mm wafer fabs.”


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