SpeedFam completes construction on new corporate headquarters
SpeedFam International, Inc.`s new 136,000-sq. ft., state-of-the-art corporate headquarters is now open. A major feature is a laboratory to support CMP (chemical mechanical polishing) development, semiconductor device cleaning, disk polishing, silicon wafer processing, and applied R&D. Class 10,000, 1,000 and 10 cleanroom labs, a dedicated software development lab, reliability testing, and training areas for tools have also been incorporated into the facility. Also included are five tool bays for process development and two bays dedicated to real-time customer training.
SpeedFam Co., Ltd., the company`s Far East joint venture has recently completed a new technology center in Ayase-City, Japan. This center will handle R&D, tool demonstration and training for its Pacific Rim operations. SpeedFam International, Inc. owns a 50 percent interest in each of two joint ventures: SpeedFam Co., Ltd., and Fujimi Corp. — SES