SEMATECH, OnTrak join on post-CMP copper cleaning
By Christine Lunday
San Jose, CA — Lam Research unit OnTrak Systems has shipped a Synergy cleaning tool to SEMA TECH`s copper interconnect line, and R&D work will soon begin to develop a post-chemical mechanical planarization (CMP) copper cleaning process at the consortium`s Austin site.
OnTrak (San Jose, CA) has been working on its CMP copper cleaning pro cess for the past six months. A new devel opment agreement will allow the firm to advance its work through SEMA TECH`s dedicated cooper line, which integrated spin-on low-k dielectric materials into its copper metal process late last year.
The agreement will involve development of OnTrak`s proprietary copper cleaning process, as well as modification of the current tool set for production capable copper cleaning.
George Casey, SEMATECH`s CMP program manager, said the development agreement is fairly open-ended, with a goal of evaluating progress by the end of 1998. There are a number of technical challenges related to the cleaning of copper. For instance, Casey said the zeta potential of copper differs from that of tungsten; process requirements will include “new chemistries for particle removal and surface passivation for inhibiting corrosion,” he said.
The work dovetails with SEMA TECH`s 1998 CMP program, which Casey said will focus on two areas: copper CMP (cleaning and polishing) and reliability performance of advanced CMP tools, an extension of an existing program.
Casey said SEMATECH also will collaborate on Cu CMP polishing, but declined to name the tool supplier.
The Information Network (Williamsburg, VA) says the world CMP market grew 56.1 percent over 1996, reaching $357.1 million last year. Robert Castellano, president, said the market should hit $555.6 million by 2000.
In 1997, a total of 300 polishers were shipped along with 785 modules. CR
Christine Lunday is the associate editor at WaferNews, a sister publication of CleanRooms.