Inspection system

Inspection system

This turnkey, in-tray semiconductor component inspection system uses Scanning Moir&#233 Interferometry (SMI) 3-D technology to achieve speeds of more than 10,000 pph for complete coplanarity, package and mark inspection, according to the manufacturer. At a resolution of 2.5 micron, the system can inspect a variety of semiconductor components, including BGA, QFP, CSP and other bumped and leaded components with nearly no changeover. A unique tray flipper aids inspection of both sides of the components and eliminates individual component handling.

PPT Vision

Minneapolis, MN

(612) 996-9500


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