Japan approves CFM drying patent application

West Chester, PA

After a 10-year wait, the Japanese patent office has approved CFM Technologies` application to patent its Direct-Displace drying technology. The technology, which has been challenged legally on grounds concerning its validity, is protected under U.S. patent No. 4,911,761. CFM executives say the Japanese patent allows the company to clarify ownership of the technology in the Asian market for semiconductor manufacturing equipment. According to CFM`s Dr. Jennifer Parker, in semiconductor wafer fabrication applications, the Direct-Displace drying method uses high concentrations of IPA vapor to lower the surface tension of (rinsing) liquid, which completely displaces the water, leaving no water marks and suppressing particle deposition on the wafers. She says the key to the method is keeping wafers immersed in the rinse until they are dry. The Japanese patent, however, will be broader in scope. “It will allow users to utilize any concentration of drying fluid,” Dr. Parker notes. — TGW