SMT TechRoll understencil roll wipes prevent smearing, bridging and solder balls caused by normal solder paste printing processes. They are constructed from a blend of virgin polyester and rayon material, which is composed of hydroentangled fibers. According to the manufacturer, they are virtually lint free, low in particulates, resist abrasion and possess excellent wet and dry strength properties. The wipes can remove residual solder paste, flux, inks and epoxies during SMT stencil cleaning with or without solvents. Stock and custom sizes are available.