SEMI conference looks at automation and integration
Tempe, AZ
The third annual Test, Assembly and Packaging (TAP) Automation and Integration conference will explore ways to help semiconductor manufacturers lower costs and increase productivity. The focus of the event, which is sponsored by Semiconductor Equipment and Materials International (SEMI) will be on the growing importance of continued cooperation and collaboration in the development of automation and integration technologies. Sessions will include discussions on such topics and trends as material tracking and traceability, factory management, and control systems strategies and automation concepts. The event is slated for February 22-23 at the Tempe Mission Palms. Two educational programs will be held in conjunction with it; the SEMI Equipment Communications Standard and General Equipment Model seminar is scheduled February 24-25, and the Semiconductor Processing Technology course is scheduled February 24-26. For information, call SEMI at (650) 940-6901. — TGW