The DEKTAK V 300-SL FOUP surface profiler with front opening unified pod (FOUP) enables process monitoring of semiconductor wafers up to 300mm in a fully automated environment. The modular design incorporates cleanroom engineering with robotic handling and SECS/GEM communications with HSMS remote control operation. According to the manufacturer, high precision, stylus-based measurement technology delivers unsurpassed step height repeatability for monitoring etch and deposition process uniformity as well as long scan capabilities for measuring CMP planarity or thin film stress on wafers.
Veeco Metrology Group
Santa Barbara, CA