Greg Reed
Editor-at-Large
Now that we have crossed the millennium threshold, what`s the state of semiconductor chip packaging? Actually, that question has preoccupied the editorial team at Advanced Packaging for the past six months now, and while we may not have the answers yet, we have the mechanisms in place to track both old and new trends that will shape our industry in 2000. Although each issue of Advanced Packaging is set to explore late-breaking technology in a broad sense, the primary editorial focus will remain on the materials, design, assembly and testing methodologies that have traditionally defined this publication.
To that end, editorial feature topics include adhesives/coatings/encapsulants, lead-free solder, thick and thin films, polymer materials, thermal management, known good die, substrates, wire bonding, socketing, burn-in test, functional test, inspection, reliability, and assembly operations.
Traditional packages, such as SOICs, TSSOPs, QFPs and MCMs, are examined from both design/assembly and market perspectives. Emerging packaging technologies, like BGA, CSP, DCA, flip chip and system-on-chip (SOC), occupy significant feature space and covers. Wafer-level packaging, while still in its infancy, signals special editorial merit with its technological challenges, significant commercial advantage and further integration with front-end wafer processes.
Aside from the technical analysis, these materials and technologies will be scrutinized in applications that range from harsh environments, such as automotive and military/aerospace, to “hot” market segments, like wireless and telecom. Additional market trends updates include design tools, specific technology status reports and industry pulse polls.
To address the continuing trend of outsourcing electronics manufacturing, “Partners in Manufacturing” enters its third year of coverage. This series provides every-issue editorial features, roundtable discussions and industry news surrounding IC manufacturing strategies from both business and technical angles. Particular emphasis centers on OEM/CM relations, supply chain management, global/regional operations and new product-to-market issues.
Finally, the annual Step-by-Step guide to semiconductor packaging walks new engineers through an increasingly automated chip packaging process. Beginning with wafer dicing and concluding with laser marking, singulation, and packing and shipping, our tutorials address the on-the-job fundamentals that confront design, manufacturing and test engineers every day.
As always, please continue to submit your company`s new products and service offerings. The editorial team strives to reflect the semiconductor packaging marketplace both in print and on-line at www.apmag.com. In case we have not met, please submit e-mail queries concerning year 2000 topics to the editorial team: [email protected], gregr@ pennwell.com or kathleenp@pennwell. com. In addition, please feel free to arrange an editorial visit with an Advanced Packaging editor at one of the major industry trade show events soon. We wish you a healthy and prosperous new millennium!