A co-curable semiconductor encapsulating system pairs a nonflowing dam material with a high-flow fill material; both materials are said to offer high glass-transition temperatures with very low CTE, good thermal-shock performance and cure schedules of 30 minutes at 150°C. The highly thixotropic dam material ME-456 is said to not self-level or slump before the cavity-fill is added. The cavity-fill material ME-455 reportedly was formulated to cure void-free, be self-leveling and have a low viscosity.
Lord Chemical Products
a division of Lord Corp.