Designed for power device and CPU (Pentium II), the folded-fin heat sink has 20 fins per inch made with a patent-pending manufacturing process. The advantages of its design are said to include better cooling (30 percent better than the extruded, with adequate airflow), low unit cost and low tooling cost for custom design, and shorter lead time for custom design. Standard size is 1.65 x 3.2 x 0.70″.
ACK Technology Inc.
Buena Park, Calif.