High-purity Underfill Encapsulant

ME-525 is a high Tg, low CTE, high-purity underfill encapsulant designed for use with small-gap flip chip devices. The product is said to penetrate gaps as small as 2 mils and cure in 30 minutes at 150°C. Easy to dispense and with high chemical and moisture resistance, the product has low viscosity, high flow for capillary chip underfill and is capable of flowing under a 1/4″ die in less than 60 seconds.


Lord Chemical Products

a division of Lord Corp.

Indianapolis, Ind.


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