Specifically, Hasper says ASMI calculations show that cycle improvements garnered through the use of integrated thin film metrology result in cost-per-wafer gains of 8%. He notes ASMI has seen cycle times for the furnace processing area drop from eight days to seven and one-half days. “That's real money,” Hasper says. “If you are able to make a shorter loop from metrology to your furnace, it will have a tremendous impact on cycle time.”

Noting that business is now on firm ground, FSI International, Minneapolis, MN, and Varian Semiconductor Equipment, Gloucester, MA, say two top executives will step out of long-held positions.