Intel's facility — Fab 22 — will begin production on 200mm wafers using 0.13 micron and copper processes next year; a transition to 300mm wafers will likely follow 12 months after, said an Intel spokesman.
Staff Reports
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Intel's facility — Fab 22 — will begin production on 200mm wafers using 0.13 micron and copper processes next year; a transition to 300mm wafers will likely follow 12 months after, said an Intel spokesman.
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