The 3500-II is a fully automatic, high-accuracy die bonder capable of performing automated eutectic die attach using backside metalized die or preforms, and enables bonding of thin die with air bridges using 2 or 4-sided perimeter collets. Using look-up and look-down cameras for flip chip applications and “relative-to” referencing for linear micro-strip line placement, the 3500-II yields accuracies of ±0.5 mil.
Palomar Technologies
Vista, Calif.