Ceramic BGA

VIA/BGA is a leadless, thin film, ceramic BGA developed for packaging devices used in broadband data links, transmitting at 10 to 20 Gbps data rates and also for packaging KA-band GaAs MMICs used in broadband wireless access systems, such as LMDS. The package is said to support the new SiGe ICs developed for OC-192 SONET/SDH systems with the capability of extending its range to more than 20 Gbps data rates. It is being adopted in millimeter-wave applications, such as LMDS and SATCOM for broadband wireless access at 24, 28 and 31.3 GHz.

Micro Substrates Corp.

Tempe, Ariz.


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