The built-in 2-D inspection system on the DEK 265 and DEK 288 surface mount screen printers reportedly is now able to validate stencil apertures and paste-on-pad for µBGA patterns at a high rate of speed. The inspection system inspects automatically for stencil cleanliness and paste-on-pad to enhance process quality while maintaining rapid cycle times. Patterns for devices with pitches as fine as 0.8 and 0.75 mm may be inspected. A typical µBGA with 48 I/Os in a 6 x 8 matrix requires four site inspections, which reportedly can be completed in less than 10 sec. On a large µBGA with 225 I/Os, 16 sites can be inspected in 45 sec. Further enhancements to inspect 0.5 mm pitch devices with up to 64 I/Os per site are in process.
DEK Printing Machines Ltd.