Motorola Manufacturing Systems has entered the wafer-level CSP arena with the Model SA-20 manual wafer-bumping system. It is said to be capable of depositing 0.010- to 0.012-in. diameter solder spheres onto 6- or 8-in. diameter wafers for interconnect formation. The system reportedly provides cost-effective methods that device and package-development engineers can use to create flip-chip bumps on silicon from development through production stages.
Motorola Manufacturing Systems
Phoenix, Ariz.