Power Board technology combines the thermal and mechanical features of ceramics with the electrical and thermal advantages of pure copper metalization. Features include plated through-hole capability, copper-plated solid thermal and hermetic vias, plated up copper heat spreaders, good solderability, ability to withstand high temperature die attach and high frequency, good gold and aluminum wire bondability, fine line resolution, and low conductor resistance.
Remtec
Norwood, Mass.