Unibond silicon-on-insulator wafers are produced using commercially available equipment with a proprietary process that uses both ion implantation and wafer bonding technologies. The silicon quality is said to exceed that of standard or low-dose wafers, and the uniformity of the silicon dioxide layer is reportedly better than SOI wafers produced by the bond and etch-stop method. Key advantages include increased power efficiency and reduced power consumption.

SOITEC

Peabody, Mass.