Technology — April 11, 2000 — IBM Outlines First-generation Copper and Low-k Products.

NEW YORK, NY—IBM announced it will use Dow Chemical's SiLK dielectric resin to integrate copper metal in the company's next line of CMOS 9S process technology. Using spin-on equipment, the company says the low-k resin will become part of its recipe for next-generation products.

By Lisa Nadile


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