Amy Knutson-Strack
Editor
As springtime activities spin around us, everyone at Advanced Packaging magazine is squeezing in time to dash off to the dry cleaners, pack suitcases and make last-minute limo reservations for the litany of upcoming shows we plan to attend. By the time this issue goes to press, we will have just completed trips to NEPCON West, APEX 2000 and IMAPS` International Symposium on Advanced Packaging Materials. We certainly understand the importance of getting away from our desks and talking with readers and industry trendsetters one-on-one – we couldn`t serve you well if we didn`t.
So, if you also plan to be at the following events in the next couple of months, please don`t hesitate to track us down. We`d enjoy the opportunity to talk with you.
– HD International Conference and Exhibition on High Density Interconnect and Systems Packaging, April 26-28, Denver, Colo.
– 50th Electronic Components and Technology Conference, April 21-24, Las Vegas, Nev.
– SEMICON West, July 10-14, San Francisco and San Jose, Calif. (This might seem far away, but it`s never too early to plan for this massive show!)
This month I would also like to extend a warm welcome to Advanced Packaging magazine`s new publisher, John Bubello, who brings with him solid experience in business-to-business trade publishing. Working with Group Publisher Becky McAdams, John will oversee all publishing operations related to the magazine. He has worked at PennWell Publishing for three years, most recently as the associate publisher of Cabling Installation & Maintenance and OSP Engineering & Construction magazines; prior to that he was the sales director for Cabling Installation & Maintenance magazine. We are thrilled that John has joined the AP team. To contact John, please e-mail him at [email protected].
Until next month,
Amy Knutson-Strack