Applied Materials Launches Sprint Tungsten CVD Centura

SANTA CLARA, Calif.—May 30, 2000—Applied Materials is now offering a new tungsten-based CVD system. The Sprint Tungsten CVD Centura uses a deposition process for void-free bulk-fill of the contact and via structures for 0.18 µm and below chip designs.

By pennNET Staff

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.