CORVALLIS, OR.—May 17, 2000—Electroglas Inspection Products has increased wafer throughput, accuracy, and repeatability of QuickSilver II post-fab bumped wafer inspection system, company officials say.
By Lisa Nadile
CORVALLIS, OR.—May 17, 2000—Electroglas Inspection Products has increased wafer throughput, accuracy, and repeatability of QuickSilver II post-fab bumped wafer inspection system, company officials say.
By Lisa Nadile
Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.