Applied and QualiTau Begin Testing Program in EPIC Facility

SANTA CLARA, CA—June 16, 2000—Applied Materials and QualiTau have started testing electromigration structures in advanced chip interconnects formed with copper and low-k dielectric materials.

By pennNET Staff


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.