SANTA CLARA, CA—June 16, 2000—Applied Materials and QualiTau have started testing electromigration structures in advanced chip interconnects formed with copper and low-k dielectric materials.
By pennNET Staff
SANTA CLARA, CA—June 16, 2000—Applied Materials and QualiTau have started testing electromigration structures in advanced chip interconnects formed with copper and low-k dielectric materials.
By pennNET Staff
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