Applied Materials’ Delivers CMP System to AMD

SANTA CLARA, Calif.—June 14, 2000—Applied Materials Inc. today announced that Advanced Micro Devices Inc. has received the company's Mirra CMP (chemical mechanical polishing) system. AMD will use it for the development of copper interconnect structures in next-generation microprocessors. The system will begin operations this month at AMD's Submicron Development Center in Sunnyvale, California.


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