TEMPE, Ariz—June 21, 2000—Motorola announced today the development of a flip-chip plastic ball grid array package that can route hundreds of I/O contacts from a chip with array pitches as low as 150 µm.
By pennNET Staff
TEMPE, Ariz—June 21, 2000—Motorola announced today the development of a flip-chip plastic ball grid array package that can route hundreds of I/O contacts from a chip with array pitches as low as 150 µm.
By pennNET Staff
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