Atmel, CS2 Developing New Thin-Film Integration Technology

SAN JOSE, Calif.—July 26, 2000—Atmel Corp. and CS2 have announced a partnership to develop a thin-film interconnect technology for multi-element integration on a single substrate.

By Stephanie J. Levy


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.