Nova Measuring Instruments to Introduce Photolithography Tools

The system uses two monitoring photolithography capabilities, Mask Overlay Registration and automated full wafer Macro Defect Inspection. The system measures the standard Overlay Registration target in multiple sites on a wafer with a repeatability of 3nm (3 sigma) without any human intervention. The system measures in parallel to processing other wafers, and does not affect the lithography cell throughput time.

By pennNET staff


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