SpeedFam-IPEC’s Introduces New CMP System

CHANDLER, AZ—July 6, 2000—SpeedFam-IPEC Inc. has introduced its new CMP system called Momentum. A new polishing system combines the company's rotational and orbital technologies. Momentum was developed for an advanced level of process capability, continued geometry shrinks down to 0.13 µm, and CMP challenges for applications such as copper and shallow-trench isolation (STI).

By pennNET Staff


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