KAOHSIUNG, Taiwan—August 2, 2000—Kulicke & Soffa Industries and Flip Chip Technologies (FCT) have completed the wafer bumping and redistribution technology transfer to Advanced Semiconductor Engineering (ASE).
By pennNet Staff
KAOHSIUNG, Taiwan—August 2, 2000—Kulicke & Soffa Industries and Flip Chip Technologies (FCT) have completed the wafer bumping and redistribution technology transfer to Advanced Semiconductor Engineering (ASE).
By pennNet Staff
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