K&S Receives $15 Million Order from ChipPAC

New York, NY—August 29, 2000—Kulicke & Soffa Industries Inc. said it received a $15 million order for its Model 8028 IC Ball Bonders from ChipPAC Inc. The bonders will be shipped to ChipPAC's semiconductor packaging and test facilities in Asia by the end of September.

By Michael Sciannamea


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