RTP Unveils New Compounds to Aid Cleanroom Apps

WINONA, MINNESOTA — September 21, 2000 — RTP Company has introduced a new range of engineering and technical compounds based on nano-filler technology which will enhance the performance of cleanroom applications, wafer processing and disk-drive components, among others.

The material, created using nano-scale hollow carbon tubes considerably smaller than carbon fibers, delivers uniform surface resistivity from ESD to strong anti-static. Similar levels of conductivity using conventional carbon materials would require higher loadings, which could affect properties such as strength, surface finish and toughness. In addition, the compounds show improvements in heat deflection, tensile strength and flexural modulus.

The compounds are available in polyefins, nylons, polycarbonate/ABS blends, polystyrene, polycarbonate, polyester, polyphenylene, sulphide, polyether imide and polyether etherketone.

Officials say the material could also be used in automobile applications including fuel systems and body components.

–Jeff VanPelt

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