Agilent Fab Line Leads to Cleanroom Expansion

PALO ALTO, Calif. — Oct. 23 — Looking to begin production of CDMA, GSM and 3G mobile handsets at its Fort Collins, Colorado facility, Agilent Technologies is gearing up for a cleanroom expansion.

Recently announced plans for a six-inch wafer fabrication line call for the construction of 15,000 square feet of new cleanroom space, with the option to expand the facility's existing ISO Class 5 (Class 100) cleanroom facility. Also, the company will likely create several mini-environments within the larger cleanroom that are expected to achieve particle levels better than ISO Class 3 (Class 1).

According to officials, the project will allow the company to keep up with expected demand for the handsets.

“The Ft. Collins facility was a logical choice because our existing high-volume silicon fab facilities and experienced talent pool will allow us to quickly ramp the new process,” said Dave Allen, vice president and general manager of Agilent's Wireless Semiconductor Division.

The fab should be in full production by the end of 2002.

–Jeff VanPelt

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