Chandler, Arizona–Oct. 19, 2000–In response to increased focus on advanced flip chip and system-in-package production, Amkor Technology–a worldwide provider of contract microelectronics manufacturing services–has added the latest equipment from several manufacturers to its expanding prototype package development lab.
“The lab was developed to ensure that our customers move from concept to production in the shortest possible time,” says Jonathon Greenwood, senior director of Amkor’s Advanced Package Development Center. “In combination with our adjacent design center, the lab specializes in reducing the time between concept and delivery for advanced flip chip and system-in-package ICs, which is a major advantage for customers.”
The lab opened last year to assist U.S.-based semiconductor companies with local development of advanced packages, and has since expanded to include the latest systems for ball attach, wire bond, and die attach processes.