IBM Plans Chip Facility in China

Shanghai, China–Oct. 27, 2000–IBM Corp. plans to invest $300 million to build a chip packaging manufacturing facility in Shanghai, China to support the company’s growing semiconductor business around the world. This investment is part of a recently announced $5 billion worldwide investment plan announced by IBM.

The new facility will produce electronic cards and high technology chip carriers incorporating IBM’s surface laminar circuitry (SLC) and HyperBGA packaging technologies. These technologies are used in wired and wireless networking applications, Web servers, and pervasive computing market segments.


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