IBM To Build Chip Packaging Facility In China

SHANGHAI, China — Oct. 31, 2000 — IBM recently announced plans to build a $300 million organic chip packaging manufacturing facility in Shanghai. The investment is part IBM’s recently announced $5 billion worldwide investment plan.

The new facility, which officials say will bolster the company’s growing semiconductor business, will be used primarily to produce electronic cards and high technology chip carriers using IBM’s Surface Laminar circuitry and HyperBGA technologies.

“The establishment of a the new packaging facility in Shanghai signifies a new phase in bringing advanced technology to China,” said Henry Chow, chairman and CEO of IBM Greater China Group. Chow also said that the announcement “is a further demonstration of IBM’s commitment to support the rapidly expanding IT infrastructure in China.”

Shanghai municipal officials have also lauded the announcement and say they are looking forward to continue working with IBM.

–Jeff VanPelt

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