STATS Offers Lead-Free IC Packaging Solution

Singapore–Oct. 24, 2000–As part of a lead-free initiative, ST Assembly Test Services (STATS), an independent semiconductor testing and advanced packaging service provider, has selected a pure tin solder alternative solution for its leaded product offering.

The company evaluated the performance of the pure tin solder finish against other lead-free finishes, comparing results across different package sizes, lead pitches, and alternative materials. Pure tin finishes have been widely used in other semiconductor devices, and STATS found them an attractive solution because of performance, quality, reliability, availability, and cost. Recent breakthroughs by electroplating chemical companies in developing a pure tin deposit designed to inhibit whisker growth on finishes, according to STATS, have enabled pure tin to be a strong replacement of tin-lead finishes.

“The goal of STATS’ green initiative was to achieve environmentally friendly packaging while maintaining the performance, reliability, and quality standards our customers require,” says Chairman and CEO Tan Bock Seng. “We are pleased to be able to offer our customers a lead-free solution to address growing market demands.”

The lead-free initiative is being driven on a global basis, with standards by the Japanese Electronic Industry Association and European Waste in Electrical and Electronic Equipment legislation.


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